High heat loading performance of actively cooled W/Cu FGM-based components
- 期刊名字:礦物冶金與材料學(xué)報(bào)
- 文件大小:
- 論文作者:Zhang-jian Zhou,Jun Tan,Dan-da
- 作者單位:School of Materials Science and Engineering,Electronic Engineering Institute,School of Mechanical & Automotive Engineeri
- 更新時(shí)間:2023-02-07
- 下載次數(shù):次
論文簡(jiǎn)介
A functionally graded material-based actively water-cooled tungsten-copper mockup with a dimension of 30 mm×30 mm×25 mm was designed and fabricated by infiltration-brazing method.The thicknesses of the pure W layer and W/Cu graded layer were 2 and 3 mm,respectively.High heat flux tests were performed on the mockup using an e-beam device.There is no damage occurring on the joint after heat loading at 5 MW/m2.The temperature on the pure W surface is less than 500 ℃ after inadiation for 100 s at 5 MW/m2,while the temperature on the brazing seam/copper surface is around 200 ℃.
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