This part of IEC 62878, which is a Technical Report, describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating the electrical test for device embedded substrate.
This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
The IEC 62878 series does not apply to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.dition 1.0 2015-12 TECHNICAL REPORT RAPPORT TECHNIQUE colour inside Device embedded substrate – Part 2-2: Guidelines – Electrical testing Substrat avec appareil(s) intégré(s) – Partie 2-2: Directives – Essai électrique IEC TR 62878-2-2:2015-12(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ？ 2015 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of th