This part of IEC 61760 defines requirements for component specifications of electronic
components that are intended for usage in surface mounting technology. To this end, it
specifies a reference set of process conditions and related test conditions to be considered
when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to
the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during
assembly. This document defines tests and requirements that need to be part of any SMD
component's general, sectional or detail specification. In addition, this document provides
component users and manufacturers with a reference set of typical process conditions used in
surface mounting technology.
Some of the requirements for component specifications in this document are also applicable
to components with leads intended for mounting on a circuit board. Cases for which this is
appropriate are indicated in the relevant subclauses.dition 3.0 2020-07 INTERNATIONAL STANDARD NORME INTERNATIONALE colour inside Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs) Technique du montage en surface – Partie 1: Méthode normalisée pour la spécification des composants montés en surface (CMS) IEC 61760-1:2020-07(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ？ 2020