IEC 61189-5-1-2016電氣材料、印制電路板和其他互連結(jié)構(gòu)及組件的試驗(yàn)方法--第5-1部分:材料與組合裝置的通用試驗(yàn)方法 印制板組件導(dǎo)則Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance fo
- 標(biāo)準(zhǔn)類(lèi)別:
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- 標(biāo)準(zhǔn)編號(hào):IEC 61189-5-1-2016
- 標(biāo)準(zhǔn)狀態(tài):現(xiàn)行
- 更新時(shí)間:2023-04-18
- 下載次數(shù):次
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.dition 1.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-1: General test methods for materials and assemblies – Guidance for
printed board assemblies
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 5-1: Méthodes d'essai générales pour les matériaux et les assemblages –
Lignes d
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