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Tangent Resistance of Soil on Moldboard and the Mechanism of Resistance Reduction of Bionic Moldboar Tangent Resistance of Soil on Moldboard and the Mechanism of Resistance Reduction of Bionic Moldboar

Tangent Resistance of Soil on Moldboard and the Mechanism of Resistance Reduction of Bionic Moldboar

  • 期刊名字:仿生工程學(xué)報(英文版)
  • 文件大?。?/li>
  • 論文作者:Deng Shi-qiao,REN Lu-quan,Liu
  • 作者單位:Ministry of Education
  • 更新時間:2023-02-27
  • 下載次數(shù):
論文簡介

The tangent resistance on the interface of the soil-moldboard is an important component of the resistance to moving soil . We developed simplified mechanical models to analyze this resistance. We found that it is composed of two components, the frictional and adhesive resistances. These two components originate from the soil pore, which induced a capillary suction effect, and the soil-moldboard contact area produced tangent adhesive resistance. These two components varied differently with soil moisture. Thus we predicted that resistance reduction against soil exerted on the non-smooth bionic moldboard is mainly due to the elimination of capillary suction and the reduction of physical-chemical adsorption of soil.

論文截圖
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