A Kind of homogeneous resin, which can be used as thermal resistant adhesive and matrix for composite,was prepared by bis(4-maleimidophenyl)methane (BMI), 4,4'-diaminodiphenylmethane(DDM), aniline(An), phenol type epoxy resin (F-51) and nitrile -butadiene rubber (NBR) through solution copolymerization. The reaction from prepolymerization to curing of the resin system was studied. And the factors such as raw material ratio and curing temperature, which affect thermal resistance and adhesives of cured product,were also analyzed. SEM and IR spectra were utilized to discuss the mechanisms of toughness and reaction of modified BMI.