The electrical conductivity of Cu-10Ag in situ filamentary composite was studied during the deformation and annealing processes. The dependence of electrical resistivity of the deformed composites on the true strain presents a two-stage change with increase of the true strain. The intermediate heat treatment and the stabilized annealing treatment to the deformed composite promote the separation of Ag precipitate, and increase the electrical conductivity. The maximum conductivity of the composite experienced the stabilizing heat treatment can reach about 97% IACS with σb≥400 MPa at 550 ℃ annealing, and reach about 70% IACS with σb≥1 250 MPa at 300 ℃ annealing. The corresponded strength of the composite was reported. The microstructure reason for the changes of the conductivity was discussed.