Thermal Analysis of High Power LED on Heat Sink
- 期刊名字:半導(dǎo)體光子學(xué)與技術(shù)(英文版)
- 文件大小:
- 論文作者:WANG Cai-feng,NIU Ping-juan,GA
- 作者單位:School of Information and Communication Engineering
- 更新時(shí)間:2023-02-07
- 下載次數(shù):次
論文簡介
Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.
論文截圖
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