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Solder bridge mechanism in surface mount technology Solder bridge mechanism in surface mount technology

Solder bridge mechanism in surface mount technology

  • 期刊名字:自然科學進展
  • 文件大?。?/li>
  • 論文作者:Li Mingyu,Wang Chunqing,ZHANG
  • 作者單位:State Key Laborator
  • 更新時間:2023-02-26
  • 下載次數(shù):
論文簡介

In the light of the minimum energy principle, the energy equation for the forming process of a joint is formulated, and the forming process of bridged joints is numerically simulated. On this basis, the mechanism of bridging in surface mount technology (SMT) is investigated.

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